ARIES ELECTRONICS / LARSEN ASSOCIATES
Adaptor Sockets ,Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets, Test Sockets, Burn-in sockets, Chip Scale Test Sockets, burn-in SMT Device Low frequency High Frequency CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSOP, SOP, LCC, PLCC, TO, RF, ZIF Any Surface Mount smt Package Style with leads or without Leads PGA packaged devices. Standard & Custom Microprocessor BGA sockets Ball Grid Array Land grid array CSP Test Sockets .5 .4 .35 .2 .3 mm pitch any SMT device
Test Sockets, Burn-In Sockets, IC Adaptors, High Temperature Sockets, Chip Adapters, Display Sockets, Standard & Custom Packaging Solutions
"Aries, the world leader in Spring Probe Test Socket & Burn-In Socket Technology"
open top burnin test socket Aries New Open Top Burn-In Socket, Shown in Open position Open Top Burn-in Socket
open top burn in test socket Aries New Open Top Burn-In Socket, Shown in Closed position
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Available Soon: and more sizes to come, contact us today.
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Test & Burn-in Sockets
Aries Electronics new patented Open Top Burn-in Socket.
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