ARIES ELECTRONICS / LARSEN ASSOCIATES
Chip Scale Test & Burn-In Sockets Test & Burn-In of Any SMT Device! CSP BGA LGA QFN DSP SRAM DRAM Flash Devices, etc.
"Aries, the world leader in Spring Probe Test & Burn-In Socket Technology"
- 23017 Style, CSP Sockets with molded bodies with custom machined interiors for any surface mount device, any SMT footprint, with Spring probes any pitch .3 mm and up.
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- Bottom View showing bottom of spring probes which make electrical contact by compression, no soldering required.
- The 23017 style is for devices from less than 1 mm up to 13 mm
- Device gides, pressure pad, and interposer are machined for your exact device footprint
- A 23017 style clamshell socket with a hole under device to accomodate a heat slug with air vents for heat dissipation. Some sockets on plexiglass simulating PCB
- A 23017 style clamshell with adjustable z-axis micrometer adjustment for delicate or variable z dimension devices.
- A 23017 style clamshell test socket showing the interior modified for another, different device. Your exact device and footprint up to 13 mm sq will fit here.
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Test & Burn-in Sockets
Aries Electronics makes a family of 5 sockets with standard molded bodies that accommodate all device sizes from less than 1 mm up to 55 mm square, and any surface mount configuration. This page shows the 23017 style socket for devices between 6.6 mm to 13 mm in size, with pitches as small as 0.2 mm and up. For Any SMT device or footprint including staggered or even mixed pitch. The most advanced test socket on the market. Bodies are molded. The interposer with spring probes, guides, & pressure pad are machined to fit your exact device.
(500,000 cycles and from under 1GHz and up to 18.5GHz, self inductance 0.51nH and signal paths as short as 0.077") Email your device drawing & quantity needed, & we will send price & delivery info quickly. Contact Us Today
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4/30/14