ARIES ELECTRONICS / LARSEN ASSOCIATES
Chip Scale Test & Burn-In Sockets Test & Burn-In of Any SMT Device! CSP BGA LGA QFN DSP SRAM DRAM Flash Devices, etc.
"Aries, the world leader in Spring Probe Test & Burn-In Socket Technology"
CSP Socket Family: 5 molded bodies with custom machined interiors for any surface mount device, any SMT footprint, with Spring probes any pitch 0.2 mm and up.
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6.5 mm shown for size. Mounted on plexiglass for illustraion purposes only.
Typical 6.5 mm Top & Bottom View showing spring probes contacts for chip scale IC device and PC board.
Typical 6.5 mm shown compared to Typical 13 mm. Your device footprint goes here.
Style 23021 and 23017 are for <1GHz, Style 24013 and 24008 are for 1GHz to 18.5GHz.
The area modified for your exact device. These socket accept any SMT device regardles of footprint. The interior is drilled, loaded, & guides & pressure pad designed for your exact device & footprint.
Aries Spring Probes. 4 point crown tips for BGA & bump devices, pointed tip for LGA & flat contacts. From 0.2 mm pitch and up.
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Test & Burn-in Sockets
Aries Electronics makes a family of 5 sockets with standard molded bodies that accommodate all device sizes from less than 1 mm up to 55 mm square, and any surface mount configuration. This page shows the 23021 style socket for devices between 6.6 mm to 13 mm in size, with pitches as small as 0.2 mm and up. For Any SMT device or footprint including staggered or even mixed pitch. The most advanced test socket on the market. Bodies are molded. The interposer with spring probes, guides, & pressure pad are machined to fit your exact device.
(500,000 cycles and from under 1GHz and up to 18.5GHz, self inductance 0.51nH and signal paths as short as 0.077") Email your device drawing & quantity needed, & we will send price & delivery info quickly. Contact Us Today
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4/30/14