ARIES ELECTRONICS / LARSEN ASSOCIATES
Adaptor Sockets ,Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets, Test Sockets, Burn-in sockets, Chip Scale Test Sockets, burn-in SMT Device Low frequency High Frequency CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSOP, SOP, LCC, PLCC, TO, RF, ZIF Any Surface Mount smt Package Style with leads or without Leads PGA packaged devices. Standard & Custom Microprocessor BGA sockets Ball Grid Array Land grid array CSP Test Sockets .5 .4 .35 .2 .3 mm pitch any SMT device
Test Sockets, Burn-In Sockets, IC Adaptors, High Temperature Sockets, Chip Adapters, Display Sockets, Standard & Custom Packaging Solutions
High-Temperature, 200¡C to 300¡C, Test & Burn-in Test Sockets
High Temp Universal DIP ZIF Burn-in & Test Sockets High Temperature Aries Larsen
Data Sheet PDF

10002HT
High-Temp (up to 300¡C) Universal DIP ZIF Burn-in & Test Sockets Ð accepts devices on 0.300 to 0.600 [7.62 to 15.24] centers in packages from 24- thru 48-pin
High Temp Universal PGA ZIF Burn-in & Test Sockets High Temperature Aries Larsen

10004HT

Data Sheet PDF
High-Temp (up to 200¡C) Universal PGA ZIF Burn-in & Test Sockets Ð for any footprint on standard 8x8 to 21x21 grids
High Temp CSP Burn-in & Test Sockets BGA, LGA, QFN, MLCC, Bumped Die SMT Aries Larsen

23026HT

Data Sheet PDF
High-Temp (up to 200¡C) CSP Burn-in & Test Sockets for BGA, LGA, QFN, MLCC, and Bumped Die Devices or Any Custom Machined Configuration Ð for high-frequency bandwidth, low inductance, and high-current applications in a reliable and durable socket housing
High-Temp High frequency High Temperature RF Test Socket MLF QFN QFP low inductance Aries Larsen

24001HT

Data Sheet PDF
High-Temp (up to 250¡C) RF Test Socket with Replaceable Contact Strips Ð for all peripheral-leaded devices including MLF, QFN, QFP with very low inductance
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2/18/15