Aries Chip Scale Test Socket Test Burn-In CSP Micro BGA Test Socket DSP LGA SRAM DRAM Flash Devices 28mm 55mm .4mm pitch up Larsen Associates


*Now available .2 mm pitch and up.*
1GHZ or less = DATA SHEET# 23020.pdf Over 1GHZ up to 18.5GHz = DATA SHEET # 24012.pdf
Features: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.20mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures scrub” on solder oxides. • Signal path during test only .077” (1.92mm) • Accommodates any package up to 27mm². • Small overall socket size/profile allows maximum number of sockets per BIB and BIB’s per oven, while being operator friendly.
Specifications: • Molded socket components are UL94V-0 PEEK and/or Ultem. • 1dB Bandwidth at 1Ghz (0.80mm pitch) (large probe). • Estimated Contact Life: = 500,000 cycles. • Compression spring probes are heat treated Beryllium Copper Alloy with 30u” min. [.75um] Gold per Mil-G-45204 over 30u” min.[.75um] Nickel per QQ-N-290. • Contact Force = 9-12g per contact on 0.50 - 0.75mm pitch 17-20g per contact on 0.80mm pitch or larger. • Operating Temperature = ^-55°C (min.) to 150°C (max.); ^-67°F (min.) to 302°F (max.). • All Hardware is Stainless Steel. • Typical Burn-in Temperature = 125°C. Mounting Considerations: • Aries supplies (4) four #4-40 screws and tapped, insulated, backing plate for mounting. • Sockets must be handled with care when mounting or removing sockets to/from PCB. • Test board PCB diameter = .026” (0.66mm)
Note: Aries specializes in custom design and production. In addition to the standard products shown on this page, special materials, platings, sizes, and configurations can be furnished, depending on quantities. Aries reserves the right to change product specifications without notice.