Aries Electronics / Larsen Associates
Test Sockets, Burn-In Sockets, IC Adaptors, Display Sockets, plus Standard & Custom Packaging Solutions
- High Frequency High Speed RF Test Sockets
- Up to 40GHz
- RF High Performace, High frequency Test Sockets,
- Standard or Custom Aries Electronics High Frequency High Performance Speed RF Test Sockets For Any Surface Mount device including CSP microBGA SSOP SOT SOP BGA LGA MLF QFN QFP high bandwidth high speed
- For any SMT Device! -.2 mm pitch & up- - Low or High Frequency,-Standard & Custom
Aries High Frequency Test sockets. RF test sockets for CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, Micro BGA, DSP, LGA, SRAM, DRAM, Bump-Array, QFN, QFP, MLF, DFN, SSOP, Flash Devices, TSOP, SOP, LCC, PLCC, TO, RF, ZIF and Any Surface Mount smt Package Style with leads or without Leads plus most PGA packaged devices.
To Receive a Quote, or Request Information or To Contact, use the "Quick Quote / Info Request Forms" OR Email POD with dimensions, frequecny required, quantity of sockets needed, plus anthing special, and include your fll contact info.
High-Frequency Center Probe
Test Socket for Devices up to 6.5mm Square
0.2 mm pitch and up
Data Sheet: 24013
CENTER PROBE SOCKETS
High-Frequency Center Probe™
Test Socket for Devices up to 13mm Square
For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash devices on any pitch of 0.30mm pitch or higher. This socket is easily mounted and removed to & from the PCB due to solderless pressure-mount compression spring probes.0.2 mm pitch and up
Data Sheet: 24008
CENTER PROBE SOCKETS
High-Frequency Center Probe™
Test Socket for Devices from 14 to 27mm Square
Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.5mm with Frequency Response over 10GHz!
0.2 mm pitch and up
Data Sheet: 24009
CENTER PROBE SOCKETS
Machined High-Frequency Center Probe
Test Socket for BGA, CSP & MLF Packages, any size package.
Our answer for a reliable Area Array Package socket. Our unique style of probes will work for any application. Available pitches down to 0.5mm with Frequency Response over 10GHz! 0.2 mm pitch and up
Data Sheet: 24010
Machined Center Probe Sockets
High-Frequency Center Probe™
Test Socket for Devices up to 40mm Square
For high-frequency Testing & Burn-In of CSP, µBGA, DSP, LGA, SRAM, DRAM and Flash Devices on any pitch device on 0.2 mm or larger. The 4-point Crown insures “scrub” on solder oxides.
Data Sheet:
24011
CENTER PROBE SOCKETS
High-Frequency Center Probe™
Test Socket for Devices up to 55mm Square
For high-frequency testing of CSP, BGA, DSP, LGA, SRAM, DRAM, and Flash devices on any pitch of 0.2 mm or larger. The four-point crown insures “scrubbing” of solder oxides, while pointed probe works with LGA’s, MLF’s, etc.
Data Sheet: 24012
CENTER PROBE SOCKETS
Long-Life Hi-Frequency
Sockets for BGA, LGA, QFN, MLCC, µBGA and Bumped Die Devices
Data Sheet: 24005
Significant improvements to our high-performance contact system. Using our proven Interposer Elastomer Technology, the new CORE feature internally controls compression to ensure stability with extremely low resistance values and much longer contact element life.
RF Test Sockets w/Replaceable Contact Strips
These sockets use our patented Microstrip™ contacts which lie flat on the DUT board and become part of the transmission line. Self-inductance as low as 0.01nH and Frequency Response to 19GHz.
Data Sheet: 24001
MICROSTRIP SOCKETS
Quick Quote / Info Request
High-Frequency Interposer Socket
Now you can get the best of both worlds! The Kapton Interposer socket gives you the High-frequency characteristics of our Microstrip™ Contact Socket combined with the close component placement of our Spring Probe Sockets. Signal paths can be as short as 0.008" [0.203mm] while the pad layouts can be identical to the package footprint.
Data Sheet: 24007
HIGH FREQUENCY
INTERPOSER SOCKET
Quick Quote / Info Request
Thermoelectric-cooled RF Test Socket
Peltier Technology is incorporated into test socket lid assembly. The thermoelectric cooler (TEC) provides fast and accurate temperature control, while the built-in epoxy-encapsulated thermistor maintains a highly-accurate temperature sensing of ±0.02°C.
Data Sheet: 24002
Thermoelectric-cooled SOCKETS
Quick Quote / Info Request
Got a "BIG" Thermal issue ;-)?
Or small issue?
Thermal Heat Sink sockets top side and bottonm side heatsinks, fans, cooling towers. heat slugs, etc.. Aries can generate Thermal Analysis reports for you.
Gallery & Information for Test and Burn-in Sockets (navigation)
Test & Burn-in Sockets
Click here for Aries Chip Scale Test Sockets:
Spring Probes, Data Sheets, & Test Reports
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