ARIES ELECTRONICS / LARSEN ASSOCIATES
Test and Burn-in Sockets, Standard & Custom Adaptors, Conversion,& Interconnect Packaging Solutions

"Aries, a world leader in test socket technology"
The ADJUSTABLE Chip Scale Test Socket:........ Freedom of Range for different device thickness options, or device fragility.
For prototypes of a chip under development that will always have the same footprint, but may have the thickness of the package vary until the design is firmed up, or have a requirement to apply minimum force, and no more, such as with fragile ceramic chips or very thin devices.
Adjustable pressure Test Socket CSP Aries Larsen Associates

Aries has developed a way of making the depth of the pressure pad adjustable, using a micrometer adjustment. This ability to incrementally add force to achieve a good connection without fear of cracking or bending a fragile device, such as a ceramic chip or a thin device, or when dealing with variable thickness issues, is a great way to only apply the minimum force to get the connection and no more.

The cutaway elevations on this page shows just one specialized application. Aries can accomodate many others. For example, other variations can include an optical pathway down the center of the adjuster.

We have the capability. Let us build exactly what you need.

Please contact us with your needs.
ADJUSTABLE, variable thickness, Chip Scale Test Socket for devices in developement. NOW available 0.3mm pitch and up.

28 mm size Adjustable socket
Open Position

Closed position.
Typical custom modification application

13 mm size Adjustable socket

13 mm size Adjustable socket
Chip Scale Test Socket Test & Burn-In of CSP, MicroBGA, QFN, DSP, LGA, SRAM, DRAM, PQFP, Flash Devices, etc. Any SMT Device!
Now available .3mm pitch and up, Spring Probe Test Sockets From Under 1GHz, to 18.5 Ghz
• Features:
For prototypes of a chip under development that will always have the same footprint, but the thickness of the package will vary until the design is firmed up.  Aries has developed a way of making the depth of the pressure pad adjustable, using a micrometer. Other variations include and optical pathway down the center of the adjuster. For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM, QFN, PQFP, BGA, Flash Devices, etc..Any Surfance mount device. • Any pitch device on 0.30mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures scrub” on solder oxides. • Signal path during test only .077” (1.92mm) • Accommodates any package up to 27mm2. • Small overall socket size/profile allows maximum number of sockets per BIB and BIB’s per oven, while being operator friendly.
• Specifications:
• Molded socket components are UL94V-0 PEEK and/or Ultem. • 1dB Bandwidth at 1Ghz  (0.80mm pitch) (large probe). • Estimated Contact  Life: = 500,000 cycles. • Compression spring probes are heat treated Beryllium Copper Alloy with 30u” min. [.75um] Gold per Mil-G-45204 over 30u” min.[.75um] Nickel per QQ-N-290. • Contact Force = 9-12g per contact on 0.50 - 0.75mm pitch    17-20g per contact on 0.80mm pitch or larger. • Operating Temperature = -55°C (min.) to 150°C (max.); -67°F (min.) to 302°F (max.). • All Hardware is Stainless Steel. • Typical Burn-in Temperature = 125°C. Mounting Considerations: • Aries supplies (4) four #4-40 screws and tapped, insulated, backing plate for mounting. • Sockets must be handled with care when mounting or removing    sockets to/from PCB. • Test board PCB diameter = .026” (0.66mm) (large probe) = .016” (0.40mm) (small probe)
basic DATA SHEET# 23018.pdf
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