ARIES ELECTRONICS / LARSEN ASSOCIATES
Adaptor Sockets ,Correct-A-Chip© Adapters, Horizontal and Vertical Display Sockets, Test Sockets, Burn-in sockets, Chip Scale Test Sockets, burn-in SMT Device Low frequency High Frequency CSP BGA, LGA, RF, ZIF, QFN, SOIC, TSSOP, DFN, PQFP, MLF, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSOP, SOP, LCC, PLCC, TO, RF, ZIF Any Surface Mount smt Package Style with leads or without Leads PGA packaged devices. Standard & Custom Microprocessor BGA sockets Ball Grid Array Land grid array CSP Test Sockets .5 .4 .35 .2 .3 mm pitch any SMT device
Test Sockets, Burn-In Sockets, IC Adaptors, High Temperature Sockets, Chip Adapters, Display Sockets, Standard & Custom Packaging Solutions
Long-Life Hi-Frequency Sockets for BGA, LGA, QFN, MLCC, µBGA and Bumped Die Devices
High-Performance Interposer Elastomer Technology Aries Larsen Associates
Aries High-Performance Interposer Elastomer Technology, utilizes the new core feature which internally controls compression to ensure stability with extremely low resistance values and much longer contact element life.

Low interconnect parasitics make these sockets an ideal choice for device characterization or high-volume production testing of devices, such as power amplifiers, mixers, highly integrated RF ICs, and microwave devices.

PDF Data Sheet: 24005
Ideally Suited for RFIC and Microwave IC Development & Test
Interposer Contact System Ð AR200 and AR300 Series Test Sockets

Interposer contact system with very short interconnects (available in 1.0mm or 0.6mm thickness) enhance adjacent channel power and noise sensitivity measurements.
 insertion loss return loss Aries Larsen Associates
impedance matching network components 1mm device pads Aries Larsen Associates
Interposer footprint lets the PCB designer locate impedance matching network components within 1mm of device pads.
High-Performance Interposer Elastomer Contact set interposer Aries Larsen Associates
High-Performance Interposer Contact Technology Suitable for Manual & Automated High-Volume Production Test
Interposer Elastomer Conductive Columns, available in 2 Standard Heights with Standard & Custom Pitches from 1.27mm to 0.4mm
High-Performance Interposer Elastomer travel Aries Larsen Associates
 AR200 Series: 1.0mm Full-Height Specifications
(measured in a 0.5mm pitch environment, GSG)
Insertion Loss S21: -1dB @ 40GHz
Return Loss S11 thru: -15dB @ 22GHz
Self Inductance: 0.33nH
Mutual Capacitance: <0.05pF
Operating Temperature: -55¡C to 155¡C
Contact Resistance: <25m½
Current Rating: 4A per lead with a 14¡C rise
Contact Length (compressed): 1.04mm
Contact Force/Travel: 25-45 gf/0.4mm travel
Contact Set Life: >2,000,000 insertions
Interposer Elastomer Life: >500,000 insertions

PDF Data Sheet: 24005
High-Performance Interposer Elastomer short travel Aries Larsen Associates
 AR300 Series: 0.6mm Half-Height Specifications
(estimated 0.5mm pitch environment, GSG)
Insertion Loss S21: -1dB @ >40GHz
Return Loss S11 thru: -15dB @ >22GHz
Self Inductance: <0.15nH
Mutual Capacitance: <0.02pF
Operating Temperature: -55¡C to 155¡C
Contact Resistance: <25m½
Current Rating: 4A per lead with a 14¡C rise
Contact Length (compressed): 0.63mm
Contact Force/Travel: 25-45 gf/0.28mm travel
Contact Set Life: >2,000,000 insertions
Interposer Elastomer Life: >500,000 insertions

PDF Data Sheet: 24005
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2/10/15